Purdue inks another semiconductor workforce agreement
Subscriber Benefit
As a subscriber you can listen to articles at work, in the car, or while you work out. Subscribe Now
Purdue University is expanding its partnership with a provider of semiconductor manufacturing technology and a provider of 3D modeling systems to further advance research and workforce training in the semiconductor industry.
The university has signed a memorandum of understanding with Lam Research and Dassault Systèmes, the university said in a news release. The three-way pact builds on the foundation of agreements Purdue entered earlier this year with each partner.
Lam Research, based in Fremont, California, will provide fabrication expertise and virtual-reality tools, the university said. Dassault Systèmes, based in France, will provide 3D modeling technology known as a virtual twin platform and other tools.
“Cutting-edge education and research are at the heart of meeting the needs of the semiconductor industry now and in the future,” Mark Lundstrom, Purdue’s chief semiconductor officer, said in the release. “This collaboration with Dassault Systèmes and Lam Research will demonstrate the power of virtual twins and simulation tools in workforce development and in accelerating the pace of innovation.”
Through the collaboration, the university said, Purdue intends to use virtual tools to accelerate workforce training and semiconductor research and help develop new high-tech components and products.
“Lam is proud to team up with Purdue and Dassault Systèmes to extend the physical world into a virtual fabrication world in order to upskill future semiconductor talent and potentially inspire future breakthroughs,” said David Fried, a corporate vice president at Lam Research.
Added Bill DeVries, vice president for industry transformation and customer success at Dassault Systèmes North America: “Our aim with this partnership is to deliver realistic, immersive workforce training that leverages the power of virtual twins that will ultimately speed design and manufacturing of future semiconductors.”
The partnership agreement is the latest initiative announced by Purdue involving semiconductor research and development. Earlier this month, South Korean chip manufacturer SK Hynix Inc. said it will spend $3.87 billion to establish a new semiconductor packaging facility at the Purdue Research Park in West Lafayette.